IEEE FINE 2026: IEEE International Conference on Future and Intelligent Networking Osaka, Japan, August 26-28, 2026 |
| Conference website | http://www.ieee-fine.org/2026/ |
| Submission link | https://easychair.org/conferences/?conf=ieeefine2026 |
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IEEE International Conference on Future and Intelligent Networking (IEEE FINE 2026), August 26-28, 2026 · Osaka, Japan
http://www.ieee-fine.org/2026
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IEEE FINE 2026 aims at bringing together interested parties (universities, research centers, industries and stakeholders) from around the world working in the fields of future and intelligent networking to exchange opinions, discuss brand-new ideas, developing innovative and emerging solutions, and establishing new collaborations.
Future Networks, Artificial Intelligence (AI), and 6G are three of the most rapidly evolving fields of technology, which develop independently yet integrated with one another. The FINE represents the emerging networking technologies, integration of AI technologies into network systems, and supporting network technologies for future mobile communications. The conference will focus on the areas in the following tracks:
Track 1: Future Mobile and Wireless Networks (6G, NTN, Extreme Network, Wi-Fi 8+)
Track 2: Open and Intelligent RAN (Open-RAN, vRAN, AI-RAN)
Track 3: Network Softwarization and Programmable Infrastructure
Track 4: AI for Network Design, Control, and Operations
Track 5: Network Automation, Analytics, and Management
Track 6: Internet of AI Agents, Embodied AI Networks, and Network for AI
Track 7: Semantic Communications, Immersive and Tactile Networking
Track 8: Cloud–Edge–Device Computing and Network–Compute Co-Design
Track 9: IoT, Vehicular, and Industrial Networking Systems
Track 10: Security, Trust, Privacy, and Network Resilience
Best Paper Award and Journal Special Issues
Three accepted papers will be selected for best paper awards. Selected papers will be recommended to Digital Communications and Networks (IF: 7.5) for potential fast-track publications.
Important Dates:
Paper Submission Due: March 30, 2026
Author Notification: June 30, 2026
Camera-Ready Due: July 26, 2026
Conference Date: August 26-28, 2026
Regular Paper Submission Guidelines:
IEEE FINE 2026 invites submission of manuscripts with original research results that have not been previously published, or are not currently under review by another conference or journal. Manuscripts must adhere to the IEEE Computer Society Proceedings Format (double column, 10pt font, letter paper) and be submitted in the PDF format. Submitted manuscripts for review should not exceed 8 pages. Upon acceptance, the camera-ready paper may extend up to 10 pages, subject to an additional fee per extra page The reviewing process will be double-blind, and submissions shall not reveal authors' names, affiliations, and avoid obvious self-references. Manuscripts should be submitted to one of the research tracks. Submissions that do not comply with these guidelines will be rejected without consideration of their merits. Accepted and presented papers will be published in the IEEE FINE 2026 Conference Proceedings and be included in IEEE Xplore.
Submission Link: https://easychair.org/my2/conference?conf=ieeefine2026
General Chairs:
Shiwen Mao, Auburn University, USA
Matti Latva-aho, University of Oulu, Finland
TPC Chairs:
Ruidong Li, Kanazawa University, Japan
Kaushik Chowdhury, Univ. of Texas at Austin, USA
Keynote Chair:
Chonggang Wang, Interdigital, USA
Panel Chair:
Reza Malekian, Malmö University, Sweden
Standardization Chair:
Periklis Chatzimisios, International Hellenic University, Greece and University of New Mexico, USA
Workshop Chairs:
JaeSeung Song, Sejong University, South Korea
Yulei Wu, University of Bristol, UK
Poster Chairs:
Chuan Foh, University of Surrey, U.K.
Wenjia Li, New York Institute of Technology, USA
Publicity Chairs:
Zhengxin Yu, Lancaster University, U.K.
Mostafa Fouda, Idaho State University, ID, USA
Yuchao Zhang, Beijing University of Posts and Telecommunications (BUPT), China
Keshav Sood, Deakin University, Australia
Publication Chairs:
Yinfeng Cao, Hong Kong Polytechnic University, HongKong
Web Chair:
Haihan Nan, Virginia Tech, USA
Steering Committee:
Reza Malekian, Malmö University, Sweden
Falko Dressler, TU Berlin, Germany
Shiwen Mao, Auburn University, USA
JaeSeung Song, Sejong University, South Korea
Paolo Bellavista, University of Bologna, Italy
Chonggang Wang, Interdigital, USA (Co-Chair)
Ruidong Li, Kanazawa University, Japan (Co-Chair)