EPEPS is the premier international conference on advanced and emerging issues in the electrical modeling, analysis, and design of electronic interconnections, packages, and systems.  Over four days, the conference will feature the latest advancements in modeling, design, and measurement techniques for SI, PI, and performance optimization in high-speed, RF, wireless and quantum systems.

Milpitas will welcome attendees in the heart of the Silicon Valley, within short distance of many prominent microelectronic companies, and of the San Jose and San Francisco international airports. 

We look forward to seeing you in Milpitas! 

Wendem Beyene & Xu Chen

General Chair and Co-Chair

Submission Guidelines

Authors are invited to submit manuscripts in a PDF format (THREE PAGES, Double-Column IEEE format) describing new technical contributions in the areas broadly covered in the Call for Papers. Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Noncompliant manuscripts will not be considered for review.

Manuscript should be in PDF format not exceeding THREE PAGES, in double-column format, including graphics (black and white) and references. All fonts and graphics should be embedded in the submitted file. All papers must be written in English. The title of the paper, names and affiliations of all authors, including complete mailing addresses, telephone, fax numbers and email addresses must appear on the first page of the paper, as well as a 35 word abstract and three keywords from the topic list. Email is absolutely necessary since it will be used for all communication with authors.Please note that, if the paper is accepted, the submitted manuscript is reproduced, as is, in the conference proceedings.

List of Topics

• Interconnects design & technologies
  • High-speed channels, backplanes, SerDes, memory, DDR interfaces
  • Interconnect and transceiver co-design, equalization
  • Signal & power integrity issues
  • Jitter, noise
  • High-frequency interconnects, packages, antennas-in-package
  • Novel/unconventional interconnect technologies
• Manufacturing and measurement
  • Manufacturing, testing, reliability
  • Measurement techniques
• Packaging and integration
  • Advanced packaging, 3D integration
  • Heterogeneous integration
  • Design of interconnects and packages
  • Quantum systems: interconnection & packaging aspects
• Modeling and simulation
  • Modeling, simulation, computer-aided design
  • Thermal, mechanical, multiphysics modeling
  • ML and AI-based approaches to interconnect and packaging problems

Venue

The conference will be held at the Sonesta San Jose - Milpitas, 777 Bellew Drive, Milpitas, CA 95035, USA

Contact

All questions about submissions should be emailed to epeps-admin@emlab.illinois.edu